Services

Simulation services

The Brio’s simulation services cover all potential problems that you can face in real world: signal integrity, power integrity, thermal analysis and EMI/EMC.

To see our strengths and expertise, move your cursor to the topic you would like to read

Simulation Services
  • General signal integrity
    • FPGA Serdes simulation
    • Pre-layout simulation
    • Post-layout simulation
    • Clock and critical nets
  • Power integrity
    • Ground & supplies bounce
    • Package WASSO analysis
    • Power planes resonance analysis
  • Connectors and vias simulation
    • Geometries optimization
    • Differential vias (>20Ghz)
  • Board and package simulation
    • Post layout analysis
    • QFN, MLF, BGA optimization
    • Board spice creation
  • Crosstalk analysis
    • Focus crosstalk on critical section
    • Entire board crosstalk
  • Thermal simulation
    • with Radition, conduction, convection
    • with laminar or turbulent flows
  • Layer stacking optimization
    • High speed optimization
    • Cost reduction
    • EMI /EMC compatibility
  • In-House seminar
    • 1 -2 days training on High speed
    • 2 days training on digital/ analog video
    • Mentor graphics presenter
  • Training classes
    • 1-2 days training on high speed design
    • 1-2 days Signal Integrity course
    • 1-2 days Power integrity course
  • EMI/EMC simulation
    • EMI simulation on PCB alone
    • EMI simulation in the enclosure
Simulation services